AG-ST-SD Aerogel Thermal Insulation Film is a flexible thermal insulation film material with ultra-low thermal conductivity, made from SiO₂ aerogel powder through a proprietary process. It features excellent environmental friendliness and easy cutting, addressing thermal management challenges in confined spaces of consumer products and providing thermal protection for heat-sensitive components. The product enhances product performance and service life while effectively reducing the risk of low-temperature burns to users caused by electronic devices. It is suitable for efficient thermal management of electronic devices with limited space, such as smartphones, tablets, wearable devices, and flexible electronic products.
Ultra-low thermal conductivity (AG-ST-SDA: ≤0.038 W/(m·K); AG-ST-SDC: ≤0.033 W/(m·K)) with good thermal stability and low heat storage, enabling efficient heat transfer blocking.
Thin-film design, flexible and non-powder-dropping, adapting to narrow installation spaces.
Supplied in rolls or sheets, compatible with various processing methods including rotary die cutting and flat die cutting, supporting customized shapes and sizes.
High compatibility, capable of being compounded with PET/PI films, graphite sheets, copper foil and other heat dissipation materials.
Environmentally compliant, meeting the requirements of RoHS Directive and REACH Regulation, with an operating temperature ≤120℃.
Facilitates product design optimization, supporting overall device thinning, energy saving, and improved design flexibility.
Application scenarios:
Heat insulation for the back plates of electronic products such as mobile phones, watches, and tablet computers
If you have any questions about the product, please feel free to contact our technical experts at any time via E-mail: lexie@ag-tech.cn
AG-ST-SD Aerogel Insulation Film has an ultra-low thermal conductivity as low as ≤0.033 W/(m·K) . While some Gore products have slightly lower thermal conductivity, AG-ST-SD offers greater flexibility in thin design (starting from 0.1mm) and die-cut customization. Its maximum operating temperature reaches 120℃, higher than Gore’s 100℃ limit.
AG-ST-SD Aerogel Insulation Film is flexible, non-powder-dropping, and compatible with PET/PI films, graphite sheets, etc. Supplied in rolls, it supports various die-cutting processes, fits narrow spaces, prevents low-temperature burns, and meets RoHS/REACH standards for better environmental friendliness.
Modern electronic devices require efficient thermal management. Thermal insulation is used to protect heat-sensitive components from high temperatures, helping to extend product lifespan and improve reliability. At the same time, it reduces surface temperature, preventing users from discomfort or low-temperature burns during operation.
Our aerogel insulation film can be combined with various substrates depending on application requirements, including PCM (phase change materials), copper foil, aluminum foil, graphite, and PI film.
This product can be benchmarked against aerogel-based thermal insulation films from Gore (USA) and Nasbis (Japan) in terms of performance and application scope.
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